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25-44 of 44 Items

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  1. NDiS-B561 12th Gen Fanless Edge PC PoE Option
    NDiS-B561 12th Gen Fanless Edge PC PoE Option

    Visual Edge PC 12th Gen Core Processor -20~60°C 1 x HDMI 2.1 2 x HDMI 2.0 8 x USB 3.2 4 x COM

    Key Features:

    • Support 12th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
    • Intel Q670E
    • Intel integrated UHD graphic engine driven by Xe architecture
    • Support 3 independent 4K2K@60Hz display outputs. HDMI 2.1 resolution can be up to 8K@60Hz
    • 1 x HDMI 2.1, 2 x HDMI 2.0
    • 8 x USB 3.2, 4 x COM,
    • 1 x GbE LAN, 2 x 2.5G GbE LAN (PoE for B561-PoE)
    • Support M.2 Key B/E/M
    • Support extended temperature -20~60°C (B561 only)
    • Fanless design
  2. eBOX710A Fanless Embedded System 11th/10th Gen
    eBOX710A Fanless Embedded System 11th/10th Gen

    Fanless Embedded System with LGA1200 Socket 11th/10th Gen Intel Core i9/i7/i5/i3 or Celeron Processor, Intel H420E, HDMI, DisplayPort, 6 USB, 4 LAN, PCIe x4 slot, and 9 to 48 VDC

    Key Features:

    • 10th/11th gen Intel Core i9/i7/i5/i3 or Celeron processor up to 65W
    • 4 GbE LAN and 4 COM ports
    • Dual 2.5" SATA HDD drive bays
    • 2 HDMI and 1 DisplayPort with dual view supported
    • -40 °C to +70 °C wide operating temperatures
    • Wide range power input from 9 to 48 VDC
    • 1 PCIe x4 slot for I/O card
    • Flexible I/O window slot for mPCIe modules
  3. VTC7260-5HCIoT/7HCIoT Fanless AI-Aided Vehicle Computer
    VTC7260-5HCIoT/7HCIoT Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU, 4 x PoE + 1 x GbE, 1 x USB 2.0, 3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGN

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0 & 2 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  4. VTC7260-5GCIoT/7GCIoT Fanless AI-Aided Vehicle Computer
    VTC7260-5GCIoT/7GCIoT Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU, 4 x 2.5GbE + 1 x GbE, 1 x USB 2.0,
    3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGN

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0 & 2 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  5. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
  6. ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail

    Key Features:

    • Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
    • Designed with rugged, compact and the hybrid thermal solutions
    • 6-port GbE PoE+ (x-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (x-coded)
    • HEVC/H.265 hardware DECODE@ 6 x 4K30 performance
    • Wide range operating temperature of -30°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 24V DC-IN for rail, ignition control & OCP/OVP
    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
  7. VTC7260-x Fanless AI-Aided Vehicle Computer
    VTC7260-x Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~65°C (15W TDP)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  8. ATC3750-A6CR NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-A6CR NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail

    Key Features:

    • Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8) performance
    • Designed with rugged, compact and hybrid cooling solutions
    • 6-port GbE PoE+ (X-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (X-coded)
    • HEVC/H.265 hardware DECODE up to 7 x 4K30 performance
    • Wide range operating temperature of -20°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 24V DC-IN for rail, ignition control & OCP/OVP
    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
  9. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  10. Neu-X303mini Edge Computing System 12th Gen CPU
    Neu-X303mini Edge Computing System 12th Gen CPU

    12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

    Key Features:

    • 12th Generation Intel Core (Alder Lake - PS) processor SoC
    • Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
    • Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
    • Onboard M.2 2280 Key M with PCIe signal for storage modules
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
    • 12V DC in
  11. eBOX671B Fanless Embedded System with 13th/12th Gen
    eBOX671B Fanless Embedded System with 13th/12th Gen

    eBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2

    Key Features:

    • 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
    • processors with Intel R680E chipset (Alder Lake S)
    • Dual DDR5 SO-DIMM for up to 64GB of memory
    • 4 LAN with optional PoE supported
    • Dual 2.5" SATA HDD drive bays with RAID 0 & 1
    • Supports MXM 3.1 Type A, up to 5 display outputs
    • -40 °C to +65 °C wide operating temperatures
    • Wide range power input from 9 to 36 VDC
    • Flexible I/O window supported via mPCIe modules
  12. TANK-880-Q370 High-Performance 8th/9th Gen PC
    TANK-880-Q370 High-Performance 8th/9th Gen PC

    Ruggedized Fanless embedded system with Intel®  i7-9700TE  1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS

    Key Features:

    • 8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
    • Dual independent displays with high-resolution support
    • Rich high-speed I/O interfaces
    • On-board internal power connector for providing power to add-on cards
    • Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
    • Great flexibility for hardware expansion
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Tekdis offers custom built solutions for your application

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