EMS-TGL Fanless Rugged Embedded System 11th Gen

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SKU:
EMS-TGL-xx5-A1-1R

11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

Key Features:

  • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
  • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
  • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
  • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
  • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
  • CE, FCC Class B, IP50
  • Wide range DC power input from +9~32V
  • Support HW TPM 2.0
  • Support vPro

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Exceptional System performance

With 11th Gen Intel Core i3/i5/i7 processors and 2 x 260-pin SODIMM socket max. up to 64GB DDR4 3200 MT/s and less than 15W TDP, the EMS-TGL fanless box PC provides a low-power and high-performance computing platform. The EMS-TGL has a diverse set of I/O interfaces, including 4 x USB3.1, 1 x DP, 1 x HDMI, 2 x COM, 2 x LAN, and 1 x 8bit GPIO, which may be expanded to meet the needs of the customer. In addition, the EMS-TGL supports a 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), and LAN 2.5G Base-Tx GbE. To match the 5G technology trend, EMS-TGL can offer high speed, low latency, and multiple connections for IoT and AIOT applications.

Advanced graphics, media, display performance

The platform's new Intel Iris Xe graphics provide up to 2.95 times faster graphics performance, as well as PCI Express* 4.0 and Thunderbolt 4/USB4. In comparison to the 8th Generation Intel Core CPUs, which had 24EU, the 11th Generation Intel Core processors had up to 96EU. EMS-TGL enables applications such as digital signage and smart retail (including AI-enhanced for analytics), as well as computer vision with inferencing capabilities for usage such as network video recorders or machine vision and inspection.

Rugged structural design for extreme environments

The tough structural design can survive high vibrations or impacts while still functioning correctly in adverse weather conditions. EMS-TGL offers various ruggedized features to be a sturdy embedded system utilised in a hard environment: metal chassis with an IP-50 classification, fanless operation with suitable thermal solutions, and passes anti-shock (5G) and anti-vibration (55G) tests. Furthermore, the computer's wide operating temperature (070°C (ST)/ -40°C (WT) and wide voltage (+9 +32 V) input with anti-interference capability safeguard the computer from overload short circuits and ensure proper system function in severe industrial applications.

IET Expansion modules for all kinds of applications

EMS-TGL supports an innovative IET (Intelligent Expansion Technology) interface which offers flexibility to integrate multiple I/O, or to develop the extension module following the project request.

EMS-TGL is engineered to deliver reliability applications, such as:

  • Industrial/ Energy
  • Office automation
  • Retail
  • Public sector
  • Automotive
  • Vision systems
  • Transportation

Key Features:

  • On board 11th Gen. Intel® Core™ i7/i5/i3 BGA Processor
  • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
  • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
  • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
  • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
  • CE, FCC Class B, IP50
  • Wide range DC power input from +9~32V
  • Support HW TPM 2.0
  • Support vPro

This product is listed in Embedded Computers, Digital Signage, Industrial Automation
-System Information-
Processor Intel® Core™ i7-1185GRE (15W, 12M Cache, up to 2.80 GHz), WT
Intel® Core™ i5-1145GRE (15W, 8M Cache, up to 2.60 GHz), WT
Intel® Core™ i3-1115GRE (15W, 6M Cache, up to 3.00 GHz), WT
Intel® Core™ i7-1185G7E (15W, 12M Cache, up to 2.80 GHz), ST
Intel® Core™ i5-1145G7E (15W, 8M Cache, up to 2.60 GHz), ST
Intel® Core™ i3-1115G4E (15W, 6M Cache, up to 3.00 GHz), ST
System Memory 2 x 260-pin SODIMM socket Max. up to 64GB DDR4 3200 MT/s
I/O Chipset EC ITE IT8528E
BIOS Information AMI uEFI BIOS 256 Mbit SPI Flash ROM
Watchdog Timer H/W Reset, 1sec. ~ 65535sec.
H/W Status Monitor CPU & system temperature monitoring and Voltages monitoring
SBC EBM-TGLS
Expansion
Expansion 1 x M.2 Key-B 2242/3042/3052 support SATA3/ PCIeIII x1/ USB3.1 and SIM slot1
1 x M.2 Key-E 2230 for Wi-Fi & BT Module(CNVi)
1 x IET interface (1 x DDI, 2x PCIe3 x 2, 3 x USB2.0, 1 x Line-Out(R/L), 1 x SMBus, LPC)
Storage
Storage 1 x M.2 Key-M 2242/2280, support PCIe Gen. III x 4 (NVMe SSD)
1 x M.2 Key-B 2242, support SATA (share with expansion slot)
I/O
USB Port 2 x USB 3.1 Gen.2 (10Gbp/s)
2 x USB 3.1 Gen.1 (5Gbp/s)
COM Port 2 x COM RS232/422/485 (select via BIOS, auto flow control via HW)
GPIO 1 x 8-bit GPIO (DB9)
SIM Slot 1 x internal SIM slot
Antenna 8 x Antenna with dust cover (6 x LTE+GPS / 2 x Wifi)
Wire-Control Power On/Off 2-Pin Terminal Block
Display
Graphic Chipset Intel® Iris® Xe Graphics (i7-1185GRE/i5-1145GRE/i7-1185G7E/i5-1145G7E)
Intel® UHD Graphics for 11th Gen Intel® Processors (i3-1115GRE/i3-1115G4E)
Spec. & Resolution DP++ 1.4: 4096x2304 @ 60Hz
HDMI 2.0b : Max. resolution 4096x2304 @ 60Hz
Multiple Display Dual Displays
Audio
Audio Codec Realtek ALC888S HD codec
Audio Interface Mic-In, Line-Out
Certifications
Certification Information CE
FCC Class B
Ethernet
LAN Chipset 1 x Intel® I225-LM
1 x Intel® I219-LM
Ethernet Interface 1 x 10/100/1000/2.5G Base-Tx GbE compatible
1 x 10/100/1000Base-Tx GbE compatible.
LAN Port 2 x RJ-45
Power Requirement
DC Input DC in 12/24V (+9V ~ +36V), wide voltage single power input
TVS component for surge protection
Reverse current/voltage protection (Max. Currency: 13A)
DC Input Connector 3-Pin Terminal Block (V+. V-, GND)
ACPI Single power ATX Support S0,S3, S4, S5
ACPI 5.0 Compliant
Power Mode AT/ATX (ATX is default setting)
Mechanical & Environmental
Operating Temperature -40°C ~ 70°C (w/SSD) ambient w/ air flow, WT sku
0°C ~ 70°C (w/SSD) ambient w/ air flow, ST sku
Storage Temperature -30°C ~ 70°C (-22°F ~ 158°F)
Operating Humidity 40°C @ 95% Relative Humidity, Non-condensing
Dimension (W x L x H) 240mm x 150mm x 48 mm (Standard)
240mm x 150mm x 69 mm (w/ IET module)
Weight 2.1 kg (System)
2.9 kg (w_Package)
Vibration Test With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis
Shock Test With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms
IP Rating IP 50
Mounting Kit Wall mount kit (standard)
DIN RAIL (optional)
Software Support
OS Information Win 10 64bit
Linux
Ordering Information
Ordering Information
EMS-TGL
11th Gen Intel® Core™ Processor i7/i5/i3 Fanless Rugged Embedded System
EMS-TGL-W85-A1-1R (i7-1185GRE)
EMS-TGL-W45-A1-1R (i5-1145GRE)
EMS-TGL-W15-A1-1R (i3-1115GRE)
EMS-TGL-S85-A1-1R (i7-1185G7E)
EMS-TGL-S45-A1-1R (i5-1145G7E)
EMS-TGL-S15-A1-1R (i3-1115G4E)
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