Industrial Automation
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  1. VTC7260-5GCIoT/7GCIoT Fanless AI-Aided Vehicle Computer
    VTC7260-5GCIoT/7GCIoT Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU, 4 x 2.5GbE + 1 x GbE, 1 x USB 2.0,
    3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGN

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0 & 2 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  2. XPPC10-200 10.1” TFT WXGA Multi-Touch Panel PC
    XPPC10-200 10.1” TFT WXGA Multi-Touch Panel PC

    15.6” TFT FHD 16:9 Slim Bezel, Multi Touchscreen Computer Powered by 11th Generation Intel Core Processor

    Key Features:

    • 10.1” TFT WXGA 16:10 panel
    • 10 points P-Cap multi-touch with slim bezel design
    • IP65 protection on the front
    • Support: VESA/panel/openframe mount
    • 11th Generation Intel Tiger Lake-UP3 Core processor SoC
    • 1 x DDR4 SO-DIMM up to 32G
    • M.2 2280 Key M (PCIe x4) for storage device
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Support power input 12 VDC
  3. ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail

    Key Features:

    • Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
    • Designed with rugged, compact and the hybrid thermal solutions
    • 6-port GbE PoE+ (x-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (x-coded)
    • HEVC/H.265 hardware DECODE@ 6 x 4K30 performance
    • Wide range operating temperature of -30°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 24V DC-IN for rail, ignition control & OCP/OVP
    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
  4. VTC7260-x Fanless AI-Aided Vehicle Computer
    VTC7260-x Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~65°C (15W TDP)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  5. ATC3750-A6CR NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-A6CR NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail

    Key Features:

    • Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8) performance
    • Designed with rugged, compact and hybrid cooling solutions
    • 6-port GbE PoE+ (X-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (X-coded)
    • HEVC/H.265 hardware DECODE up to 7 x 4K30 performance
    • Wide range operating temperature of -20°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 24V DC-IN for rail, ignition control & OCP/OVP
    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
  6. Neu-X303mini Edge Computing System 12th Gen CPU
    Neu-X303mini Edge Computing System 12th Gen CPU

    12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

    Key Features:

    • 12th Generation Intel Core (Alder Lake - PS) processor SoC
    • Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
    • Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
    • Onboard M.2 2280 Key M with PCIe signal for storage modules
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
    • 12V DC in
  7. ATC3520-IP7-4C/AI4CR NVIDIA Jetson Orin Nano
    ATC3520-IP7-4C/AI4CR NVIDIA Jetson Orin Nano

    Discover the ATC3520-IP7-4C/AI4CR: Your Edge AI computing solution with NVIDIA Jetson Orin Nano, IP67 design, and certifications for industrial needs.

    Key Features:

    • Edge AI in-vehicle/rail computer
    • Built-in NVIDIA Jetson Orin Nano SOM, up to 40(sparse) INT8 TOPS
    • 4-Port GbE PoE+ for IP CAM/LiDAR sensors
    • HEVC/H.265 hardware CODEC, 11x 1080p30 compute power (decoded)
    • Wide range operating temperature of -30~70°C
    • Rugged, fanless design with an IP67 rating
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • NEXCOM Acceleration Linux (NAL) OS w/ JetPack 5.1.1 integrated
    • Expansible for LTE/5G NR & Wi-Fi 5/6
    • 9~36V DC-in with ignition control & OCP/OVP
    • CE/FCC, UKCA, Emark/EN50155 certified
  8. TANK-880-Q370 High-Performance 8th/9th Gen PC
    TANK-880-Q370 High-Performance 8th/9th Gen PC

    Ruggedized Fanless embedded system with Intel®  i7-9700TE  1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS

    Key Features:

    • 8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
    • Dual independent displays with high-resolution support
    • Rich high-speed I/O interfaces
    • On-board internal power connector for providing power to add-on cards
    • Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
    • Great flexibility for hardware expansion
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Tekdis offers custom built solutions for your application

Tell us what you need