Industrial Automation
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17 Items

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  1. NISE-109 Compact Fanless Embedded System
    NISE-109 Compact Fanless Embedded System

    Celeron Processor J6412 Quad Core, 2.0GHz/Atom Processor x6211E Dual Core, 1.3GHZ

    Key Features:

    • Onboard Intel Celeron processor J6412 2.0Ghz or Atom processor x6211E 1.3Ghz
    • Dual display port: 1 x HDMI & 1 x DP
    • 2 x Intel I210-IT GbE LAN ports; support WoL, teaming, PXE, and Ethercat
    • 3 x USB 3.0 & 3 x USB 2.0
    • 2 x RS232 & 2 x RS232/422/485
    • Support 1 x 2.5” SSD & 1 x M.2 Key B storage
    • Support 9~30V DC input; support ATX power mode
    • Operation temperature
      - Intel Celeron J6412: -10°C to 60°C
      - Intel Atom x6211E: -20°C to 70°C
    • Support 1 x M.2 & 1 x mini-PCIe expansion slot
    • Support TPM 2.0
  2. AIE100-ONX Fanless Edge AI System w/ NVIDIA Jetson Orin NX SoM
    AIE100-ONX Fanless Edge AI System w/ NVIDIA Jetson Orin NX SoM

    Fanless Edge AI System with NVIDIA Jetson Orin NX SoM, 1 x HDMI, 1 x GbE LAN, 1 x GbE PoE and 2 x USB, Remote Management Service Empowered by Allxon

    Key Features:

    • NVIDIA Jetson Orin NX with 1024-core NVIDIA Ampere GPU
    • High AI computing performance for GPU-accelerated processing
    • Ideal for edge AI smart city applications
    • Supports one 15W GbE PoE for camera
    • Wide operating temperature from -30°C to +50°C
    • JetPack supported
    • Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
  3. AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
    AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin

    Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications

    Key Features:

    • NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
    • 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
    • 24 VDC with ignition power control
    • Supports eight PoE for IP cameras and LiDAR connectivity
    • -30°C to +50°C operating temperature range
    • Supports device management and optional OTA deployment powered by Allxon
  4. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  5. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
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