In-Vehicle & Railway AI Computers
Tekdis provides a wide range of mobile solutions for AI and deep learning applications, including both low and high-end options, such as Intel x86 systems with accelerator cards and NVIDIA Jetson-based platforms. We offer a selection of communication modules and accessories, including LTE, WLAN, GPS, Untethered Dead Reckoning GPS, CAN Bus, and Tyre Pressure Monitoring. Some models also feature integrated Power-Over-Ethernet (POE) for connecting to IP cameras or RFID readers. Our solutions enable you to implement mobile NVRs, ANPR systems, telematics, and vehicle health monitoring. For railway applications, we offer EN50155-certified models suitable for rolling stock and trackside installations. If you need assistance finding the right vehicle PC for your needs, contact our expert team today.
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ATC3750-IP7-6C NVIDIA Jetson AGX Orin Edge AI Computer
NVIDIA Jetson AGX Orin Solution for Performance Edge AI Computing
Key Features:
- Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
- Designed to be IP67-rated, rugged, and compact
- 6-port GbE PoE+ for IP CAM/LiDAR sensors, optional 1-port 10GbE
- HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
- Wide range operating temperature of -25°C~70°C
- Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
- Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
- 9~36VDC & 24V rail combined, ignition control & OCP/OVP for In-vehicle/Rail
- Military standard of MIL-STD-810H for anti-vibration/shock
- CE/FCC, UKCA, E-mark, EN50155 (EN50121-3-2, EN61373, OT3) Certified
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AIE510-ONX Fanless Edge AI System with NVIDIA Jetson Orin NX
NVIDIA Jetson Orin NX 16GB, 1 HDMI, 1 GbE PoE, 1 2.5 GbE PoE, 2 USB, 1 COM/CAN, and 8-CH DIO for AMR & Robotics
Key Features:
- NVIDIA Jetson Orin NX (100 TOPS)
- Seamless speed: 5G, Wi-Fi 6E, and 2.5 GbE combined
- Easily manage: USB and PoE device power control
- Supports dual PoE for camera & sensor connectivity
- -25°C to +60°C operating temperature range
- Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
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AV600X-CH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
- Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
- NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
- MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 55°C
- Optional with External GPU Turbo Kit
- Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
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AV600-THT Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
- Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
- Soldered 64 GB NVMe
- IP65 2 x 2.5” SATA SSD Easy Swap Tray
- MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 70°C
- Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
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AV600TH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
- 64GB DDR4 SO-DIMM ECC or non ECC support
- NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
- 2.5” SATA SSD
- 1x 3G-SDI Capture Card (Options)
- MIL-STD-461 18V~36V DC-Input
- Extreme Temperature: -20 to 55°C degrees
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ATC8110/8110-F i7 Mobile Expandable AI PC
Intel Coffee Lake S/Refresh + Inference Accelerator AI Powered for Autonomous and Machine Vision
Key Features:
- In-vehicle AI recognition and machine vision applications
- Fanless/fan flexibility design
- Up to 8-core Intel® Coffee Lake S/Refresh processing power
- 3 x PCIe 3.0 slots for Discrete Graphics/Inference/Frame Grabber cards
- Ultra-fast U.2/M.2 NVMe media for high-speed multi-cameras image capture
- RAID 0/1/5/10 configurable for data secure and integrity
- Wide-range 9~36VDC input with Ignition management
- Rich communication ports, 5 x USB 3.1, 2 x GbE and 4 x RS232/422/485
- Telemetric functionality of WWAN/5G NR, WLAN and GNSS with up to 4 x 4 MIMO and 4 SIM slots
- Compliant with E-mark, CE/FCC ClassA and MIL-STD-810G for anti-vibration/shock w/ graphics card installed
- Realize M-2-M through CAT-M (NB-IoT & eMTC)