NDiS B560S – 8/9th Gen, 3x HDMI fanless slim

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SKU:
NDiS B560S
Brand: Nexcom
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  • Support 9th and 8th Gen Intel® Core™ i7/i5/i3 LGA socket type embedded processor, up to 35W
  • Intel® H310
  • Intel® integrated UHD 630 graphic engine
  • Support 2 independent 4K2K 60Hz display output
  • Compact and slim design (H: 39mm)
  • Support 1 x 2.5” SATA HDD
  • 3 x HDMI 2.0, 4 x USB 3.0, 2 x USB 2.0, 2 x GbE LAN, 4 x COM, 1 x Line-out, 1 x Mic-in
  • Support M.2 Key B/E/M
  • Fanless design
CPU Support 9th and 8th Gen Intel® Core™ i7/i5/i3 LGA socket type processor, up to 35W
- Core™ i7-9700TE, 8 Core, 1.8GHz, 12M Cache
- Core™ i5-9500TE, 6 Core, 2.2GHz, 9M Cache
- Core™ i3-9100TE, 4 Core, 2.2GHz, 6M Cache
- Core™ i7-8700T, 6 Core, 2.4GHz, 12M Cache
- Core™ i5-8500T, 6 Core, 2.1GHz, 9M Cache
- Core™ i3-8100T, 4 Core, 3.1GHz, 6M Cache
Chipset Intel® PCH H310
Graphics Intel® UHD graphics 630 series
Main Memory 2 x 260-pin SO-DIMM sockets, support DDR4 2666 MHz non-ECC, un-buffered memory up to 32G (single socket max. 16GB)
I/O Interface-Front 1 x Power button with LED1 x Power LED, 1 x HDD LED1 x Reset switch2 x USB 2.04 x DB9 for COM1~ COM4
- COM1: RS-232/422/485
- COM2~4: RS232
2 x Antenna hole
I/O Interface-Rear +12V DC-in3 x HDMI 2.04 x USB 3.02 x RJ45 with LED for 10/100/1000Mbs2 x Antenna hole
Ethernet 1 x Mic-in, 1 x Line-out2 x Antenna hole
I/O Interface-Internal 8CH GPIO support 4 x GPO and 4 x GPIOnboard TPM 2.0 (by request)
Storage 1 x SATA 2.5” HDD/SSD1 x M.2 2280 (SATA)/2242 (by request) Key M socket
Expansion 1 x M.2 2230 Key E (PCIe x2), support optional Wi-Fi modules1 x M.2 3042/3052 Key B (PCIe x1, USB 2.0), support optional 3G, 4G or 5G modules1 x SIM slot
Power Supply 1 x External 96W AC/DC power adapterInput: 100VAC to 240VACOutput: DC+12VDC
Environment Operating temperature: 0°C to 40°CStorage temperature: -20°C to 80°CHumidity: 10 to 90% (non-condensing)
Certification CE ApprovalFCC Class A
Dimensions 238mm (W) x 192mm (D) x 39mm (H)
Operating System Support Win10/Linux
We build to order