nROK7252-AC8S Fanless Rolling Stock Computer

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SKU:
nROK7252-C8S
Brand: Nexcom

Fanless Rolling Stock Computer with Intel® Core™ 8th Gen. CPU


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·         Intel® Coffee Lake S/Refresh 9th/ 8th-Gen Core™/Xeon® LGA1151 socket-type CPU

·         8 x 10/100/1000 PoE 802.3af/at

·         Six SIM cards + three WWAN modules support

·         4 x External SSD for RAID 0, 1, 5, 10(compatible with 15mm disk)

·         2 x mSATA (occupied mini-PCIe slot)

·         EN50155 conformity

·         Three video outputs, one VGA and two HDMI

·         3 x mini-PCIe + 2 x M.2 socket expansion

·         1 x SD card for exporting and backing up data

·         Wide voltage input 14~48 VDC


This product is listed in Mobile Computing, Transport

CPU

  • Intel® Coffee Lake S/Refresh 9th/ 8th-Gen Core™/Xeon® LGA1151 socket-type CPU
  • Intel® Xeon® E-2278GEL (8 core)
  • Intel® Core™ 9th Gen. (Coffee Lake Refresh) i7-9700TE (8 core) & i5-9500TE (6 core) & i3-9100TE (4 core)
  • Intel® Core™ 8th Gen. (Coffee Lake-S) i7-8700T (6 core) & i5-8500T (6 core) & i3-8100T (4 core) & Celeron® G4900T (2 core)

Chipset

Intel® C246 platform controller hub

Memory

2 x 204-pin DDR4 SO-DMIM sockets up to 32GB/channel (64GB for two channels), default 4GB + 4GB industrial grade memory

Video Output

  • Chipset Intel® UHD graphics 630
  • 2 x HDMI 1.4b up to 4096 x 2160 @ 30Hz
  • 1 x VGA up to 1920 x 1200 @ 60Hz

Storage

  • 4 x 2.5” SATA 3.0 external SSD (compatible with 15mm drive)
  • 2 x mSATA (occupied mini-PCIe slot)
  • 1 x removable SD 3.0

Expansion

  • 1 x Full size mini-PCIe socket (USB 2.0 + PCIe 3.0 / SATA)
  • 1 x Full size mini-PCIe socket (USB 2.0 + PCIe 3.0 / SATA), BOM optional
  • M.2 key B (USB2.0 + USB 3.0) with 2 x external SIM
  • 1 x Full size mini-PCIe socket (USB 2.0 + USB 3.0 (BOM optional)), BOM optional M.2 key B 3042/3052 (USB2.0 + USB 3.0 / PCIe 3.0 (BOM optional) + PCIe 3.0 (BOM optional)) with 2 x external SIM
  • 2 x M.2 key B 3042/3052 (USB2.0 + USB3.0 + PCIe 3.0 (BOM optional))with 2 x external SIM

GNSS and On Board Sensor

  • 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou
  • Optional M8U/M8L modules with dead reckoning available
  • G Sensor (3-axis, 10-bit resolution)

LAN

  • 8-Port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE,PoE 802.3af/at, max. 60W
  • 2-Port LAN M12 X-coded, 10/100/1000 Mbps I210-IT GbE

I/O Interface-Front

  • 24 x LED indicators (including 3 x programmable LED)
  • 2 x HDMI 1.4b
  • 1 x VGA
  • 2 x USB 3.1 type A (5V/1A)
  • 6 x Externally accessible SIM card sockets with cover
  • 4 x 2.5” removable SSD tray
  • 1 x SD with cover
  • 1 x Reset button
  • 1 x Power button
  • 10 x SMA antenna

I/O Interface-Rear

  • 2 x LAN M12 X-coded, I210-IT 10/100/1000 Mbps
  • 1 x Mic-in, 2 x Line-out (DB9, female)
  • 1 x M12 A-coded connector for 2 x USB2.0
  • 2 x USB 3.1 (5V/1A) type A
  • 2 x DB9 (COM1/COM2) for full RS232 (isolation)
  • 1 x DB9 (MULTI PORT) for full RS232/422/485 (isolation)
  • 1 x DB15 (CAN/GIO)
  • 1 x Isolated CANBus 2.0B
  • 4 x DI and 4 x DO (isolation)
  • GND
  • Power in, 14~48VDC
  • 1 x Waterproof DC Input Connector with ignition
  • DC 24V/36V (14-48VDC) (w/o isolation)
  • 3 x SMA antenna

Power Management & Software Support

  • Power input 24V/36V w/o isolation
  • Selectable boot-up & shut-down voltage for low power protection by software
  • Setting 8-level power on/off delay time by software
  • Support S3/S4 suspend mode
  • 10~255 seconds WDT support, setup by software
  • SDK (Windows/Linux) including utility and sample code

Operating System

Windows 10/Linux

Dimensions

260 x 266 x 110 (W x D x H)(mm)

Weight

TBD

Environment

  • Operating temperatures: -40°C to 70°C (w/industrial SSD) with air flow
  • Storage temperatures: -40°C to 80°C
  • Relative humidity: 90% (non-condensing)
  • Vibration (random)
  • 2g@5~500 Hz (in operation, SSD)
  • Vibration (SSD)
  • Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
  • Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test
  • Shock (SSD)
  • Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g
  • Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g

Certifications

  • CE
  • FCC Class A
  • EN 50155:2017
  • Ambient temperature EN 50155, class OT4 (-40 ~ 70°C)
  • Shock and vibration IEC 61373 class B
  • Interruptions of voltage supply class S1,S2
  • Supply change over class C1,C2
  • EMC EN 50121-3-2:2016