IPC960-525-FL - Fanless 8th/9th Gen Front-access I/O -10°C to +60°C

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IPC960-525-FL

Brand: Axiomtek

Fanless Industrial System with LGA1151 Socket 8th/9th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor, Intel® H310/Intel® Q370, Front-access I/O, -10°C to +60°C

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Overview

LGA1151 Socket 9th/8th gen Intel® Core™ processor, up to 65W
M.2 Key B slot for 5G wireless connection (optional)
Supports RAID 0,1 (Intel® Q370)
Supports Power-on delay function
Supports TPM 2.0
Supports AMT 12 (Intel® Q370)
Supports 2-slot/4-slot expansion kit for further expansion

Specifications

CPU	9th/8th gen Intel® Core™ processor, up to 65W
Chipset	Intel® H310/Intel® Q370
System Memory	2 x DDR4-2666/2400 MT/s un-buffered SO-DIMM, up to 64GB
BIOS	AMI
COM	1 x RS-232/422/485 (default RS-232) More COM ports available from extension I/O modules
USB	Intel®H310: 4 x USB 3.1 Gen1 2 x USB 2.0 1 x USB 2.0 (internal, 180D type A for license key, up to 30mm) Intel®Q370: 4 x USB 3.1 Gen2 2 x USB 2.0 1 x USB 2.0 (internal, 180D type A for license key, up to 30mm) More USB ports available from extension I/O modules
Ethernet	2 x 10/100/1000 Mbps (Intel® i211-AT & i219-LM) More LAN ports available from extension I/O modules
Display	1 x VGA 1 x HDMI
Digital I/O	Available from extension I/O modules
Audio	1 x Line-out
Storage	-10°C to +60°C (+14°F to +140°F) with Intel®, 9th/8th gen Intel® Core™ and W.T. HDD/SSD
Expansion	1 x SIM slot Intel® H310: 1 x Full-size PCI Express Mini Card slot (USB interface) Intel® Q370: 1 x Full-size PCI Express Mini Card slot (USB & PCIe interface) or 1 x M.2 Key B 3050 socket
Others	TPM 2.0 AMT 12
Power Supply	Type: ATX/AT Input: 24 VDC (uMin=19V/uMax=30V)
Construction	Aluminum extrusion heavy-duty cold-rolled steel
Operating Temperature	-10°C to +60°C (+14°F to +140°F) with Intel®, 9th/8th gen Intel® Core™ and W.T. HDD/SSD
Relative Humidity	10% to 90%, non-condensing
Dimensions (W x D x H)	83.5 x 192 x 230 mm (3.28" x 7.54" x 9.04")
Weight (net/gross)	3.82 kg (8.43 lb)/4.78 kg (10.55 lb)

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